Description
Specification:
8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate
HDI PCB, High Frenquency PCB
Based on a variety of parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect towards the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest amount of approach manage.
Vital for the impedances inhigh frequency printed circuit boardsare principally the conductor trace geometry, the layer buildup, along with the dielectric continuous (er) on the supplies applied.
HDI PCB Materials used for HF circuit boards
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
HDI PCB Specifications
- Base Material: FR4
- Number of Layers: 2-32 L
- Board Thickness: 0.4-3.2 mm
- Copper Thickness: 0.5 OZ to 7.0 OZ
- Min. Hole Size: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
- Min. Line Width: 3mil (0.075mm)
- Surface Finishing: HASL lead free
- Solder Mask Color: Green
- Certificate: UL, ISO 9001, ISO 14001
HDI PCB Application
Our HDI PCB are ideal for many applicaitons, like communication industry, medical equipments, consumer electronics and automobile industry. We supply high-precision, high-density, double-sided and multilayer HDI PCB for mobile phones, computers, LED, etc.
Layers 4 Layers
Material FR-4 EM-825
Board Thickness 0.8mm
Copper Thickness 1oz
Surface Treatment ENIG
Soldmask & Silkscreen Green & White
Quality Standard IPC Class 2, 100% E-testing
Certificates TS16949, ISO9001, UL, RoHS
What KAZ Circuit can do for you:
PCB manufacturing (prototype, small to medium, mass production)
Components Sourcing
PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Gerber File, with detail specification of the PCB
BOM List (Better with excel fomart)
Photoes of the PCBA (If you have done this PCBA before)
Company Informaiton:
ZR Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP
SMT Capacity
Assembly Lines Equipments Fit Components Sizes Fit PCB Sizes Supported Components Theoretical CPH Fit for Products
Min Max Min Max Chip IC
